MEROSTA 2023:The 15th International Conference on
Mechatronics and Robotics, Structural Analysis

Bern, Switzerland, December 21-23, 2023

About the Conference

You can upload an Abstract in the conference. The Full Article is not mandatory. You can give us a full article later or after the conference. The Full papers (not mandatory) will be evaluated for possible publication in Scopus, ISI, DBLP, ACM, EI Compendex, GoogleScholar, Copernicus indexed Journals. After peer review your full article will appear in these Journals We can publish your paper as Chapter in Books of Springer Verlag also. We can also recommend your paper in some other conference that publish papers with IEEE in IEEEXplore or with Springer Verlag.



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Abstract (or Full Paper) Submission

Organizing Committee

  • Prof. Joeseph Quartieri, Department of Civil Engineering, University of Salerno, Italy
  • Prof. Ivan Kazachkov, Nizhyn Mykola Gogol State University, Nizhyn, Chernihiv Oblast, Ukraine
  • Prof. Ioannis Doltsinis, Faculty of Aerospace Engineering and Geodesy, University of Stuttgart, Stuttgart, Germany
  • Prof. Claudio Guarnaccia, Department of Civil Engineering, University of Salerno, Italy
  • Prof. Lucjan Setlak, Polish Air Force University, Deblin, Poland
  • Prof. Cho W. Solomon To, ASME Fellow, University of Nebraska, Lincoln, Nebraska, USA
  • Prof. Hyung Hee Cho, ASME Fellow, Yonsei University (and National Acamedy of Engineering of Korea), Korea
  • Steering Committee

    • Prof. Kumar Tamma, University of Minnesota, Minneapolis, MN, USA
    • Prof. Pierre-Yves Manach, Universite de Bretagne-Sud, Bretagne, France
    • Prof. Jiin-Yuh Jang, University Distinguished Professor, ASME Fellow, National Cheng-Kung University, Taiwan
    • Prof. Robert Reuben, Heriot-Watt University, Edinburgh, Scotland, UK
    • Prof. Ali K. El Wahed, University of Dundee, Dundee, UK
    • Prof. Igor Sevostianov, New Mexico State university, Las Cruces, NM, USA
    • Prof. Ramanarayanan Balachandran, University College London, Torrington Place, London, UK
    • Prof. Sorinel Adrian Oprisan, Department of Physics and Astronomy, College of Charleston, USA
    • Prof. Yoshihiro Tomita, Kobe University, Kobe, Hyogo, Japan

    Program Committee

    • Prof. Ottavia Corbi, University of Naples Federico II, Italy
    • Prof. Xianwen Kong, Heriot-Watt University, Edinburgh, Scotland, UK
    • Prof. Christopher G. Provatidis, National Technical University of Athens, Zografou, Athens, Greece
    • Prof. Ahmet Selim Dalkilic, Yildiz Technical University, Besiktas, Istanbul, Turkey
    • Prof. Essam Eldin Khalil, ASME Fellow, Cairo University, Cairo, Egypt
    • Prof. Jose Alberto Duarte Moller, Centro de Investigacion en Materiales Avanzados SC, Mexico
    • Prof. Seung-Bok Choi, College of Engineering, Inha University, Incheon, Korea
    • Prof. Marcin Kaminski, Department of Structural Mechanics, Al. Politechniki 6, 90-924 Lodz, Poland
    • Prof. ZhuangJian Liu, Department of Engineering Mechanics, Institute of High Performance Computing, Singapore
    • Prof. Junwu Wang, Institute of Process Engineering, Chinese Academy of Sciences, China
    • Prof. Jia-Jang Wu, National Kaohsiung Marine University, Kaohsiung City, Taiwan (ROC)
    • Prof. Moran Wang, Tsinghua University, Beijing, China
    • Prof. Gilbert-Rainer Gillich, "Eftimie Murgu" University of Resita, Romania
    • Prof. Efthimios Karymbalis, Harokopio University, Athens, Greece

    Topics of Interest

    Mechatronics, Mechatronics systems, Machine vision, Automation and robotics, Servo-mechanics, Sensing and control systems, Automotive engineering, automotive equipment in the design of subsystems such as anti-lock braking systems, Computer-machine controls, such as computer driven machines like IE CNC milling machines, Expert systems, Industrial goods, Consumer products, Medical Mechatronics, medical imaging systems, Structural dynamic systems, Transportation and vehicular systems, Mechatronics as the new language of the automobile, Diagnostic, reliability, and control system techniques, Computer aided and integrated manufacturing systems, Computer-aided design, Engineering and manufacturing systems, Packaging, Microcontrollers / PLCs, Mobile apps Mechanical engineering and materials science, Systems and control engineering, Optomechanics (optical engineering), Robotics, Actuation, Sensing, Motion and manipulation, Locomotion, Environmental interaction and navigation of Robots, Human-robot interaction, Control of Robots, Autonomy levels, Robotics research, Dynamics and kinematics, Education and training of Robots, Kinematics, dynamics, control, and simulation of robots and intelligent machines and systems, design of robotic mechanisms, man-machine interface and integration, robotics-related computer hardware, software, and architectures, linkage to computer-aided engineering, robotics in manufacturing and flexible automation, robotics and automation in less structured environments, vision and other non-contact sensory systems, and tactile and other contact sensory technology, Structural analysis, Structural Mechanics, Applied Mechanics, materials science and applied mathematics to compute a structure's deformations, internal forces, stresses, support reactions, accelerations, and stability. Method of Joints, Method of Sections, Elasticity methods, Methods using numerical approximation, Finite Elements, Finite Differences, Boundary Elements, Integral Equations, Optimization for Structural analysis. Others...

    Location and Venue

    Conference Publications

    You can upload an Abstract in the conference. The Full Article is not mandatory. You can give us a full article later or after the conference. The Full papers (not mandatory) will be evaluated for possible publication in Scopus, ISI, DBLP, ACM, EI Compendex, GoogleScholar, Copernicus indexed Journals. After peer review your full article will appear in these Journals We can publish your paper as Chapter in Books of Springer Verlag also. We can also recommend your paper in some other conference that publish papers with IEEE in IEEEXplore or with Springer Verlag