CC 2022:The 14th International Conference on Communications and Computers

All the papers of our Conferences will appear (after peer review) in ISI/SCOPUS/EI Compendex/IET (Inspec)/Google Scholar indexed Journals. 
The registration fees depend on the indexing of the particular Journal. We offer better APC (Article Processing Charges / Fees) than the Web Sites of these OA Journals, because we deliver them great numbers of papers. So, publish, via our Conferences, in highly reputable ISI/SCOPUS/EI Compendex/IET (Inspec)/Google Scholar indexed Journals and present your paper using Video Presentation in more than 1000 scholars each time. We can publish your paper as Chapter in Books of Springer because we are in collaboration with more than 30 Editors worldwide that collect papers in their Books at the moment. We can recommend you also publication in some other conferences that publish papers with IEEE in IEEEXplore or with Springer.

* Authors will be informed about the title of the Journal that can publish their paper before their registration. The authors are entitled to refuse the registration fees, if they do not agree with the journal.
* The Distribution of the articles to the various journals is completed by the Organizing, Steering and Program Committee based on the reviewers' comments.
* There are not any other additional fees for publication of your paper in these journals. The organizers pay for the publication of your paper(s) you using your registration fees. For this reason, in our conference the registration fees are per paper.  

* Contact us by email: support@inase.org   Registration fees       Publication Ethics and Malpractice Statement     Deadlines

Papers must be written in the correct format:  MS Word.doc  or LaTeX  or LaTeX2   and must be uploaded using the following form as .doc, or .pdf file. Invited and Regular Papers will be published in various Indexed Journals based on quality and reviewers' recommendations. Only full papers will be promoted to reviewers for thorough peer review.


Click here for Submission

• Prof. Dimitri Kazakos, Texas Southern University, USA
• Prof. George Tsekouras, University of West Attica, Egaleo, Athens, Greece
• Prof. Valeri Mladenov, Technical University of Sofia, Sofia, Bulgaria
• Prof. Aida Bulucea, University of Craiova, Craiova, Romania
• Prof. James Lam, IEEE Fellow, IET Fellow, IMA Fellow, The University of Hong Kong, Hong Kong
• Prof. Bimal Kumar Bose (Life Fellow IEEE), The University of Tennessee, Knoxville, USA
• Prof. Narsingh Deo, IEEE Fellow, ACM Fellow, AAAS Fellow, ICA Fellow, Orlando, Florida, USA
• Prof. Pierre Borne, ex IEEE France Section Chair, IEEE Fellow, IEEE/SMC Past President, Ecole Centrale de Lille, France
• Prof. Wasfy B. Mikhael, IEEE Fellow, Vice President IEEE Circuits and Systems, University of Central Florida, Orlando, USA
• Prof. Yuriy S. Shmaliy, IEEE Fellow, Universidad de Guanajuato, Mexico
• Prof. Maria Isabel Garcia-Planas, Universitat Politecnica de Catalunya, Spain
• Prof. Theodore B. Trafalis, University of Oklahoma, USA
• Prof. Panagiotis Agathoklis, University of Victoria, British Columbia, Canada

• Prof. Kamisetty Rao, IEEE Fellow, University of Texas at Arlington, USA
• Prof. D. Subbaram Naidu, IEEE Fellow, Idaho State University, USA
• Prof. Tadeusz Kaczorek, IEEE Fellow, Warsaw University of Technology, Poland
• Prof. Demetri Terzopoulos, IEEE Fellow, ACM Fellow, University of California, Los Angeles
• Prof. Georgios B. Giannakis, IEEE Fellow, University of Minnesota, USA
• Prof. Stamatios Kartalopoulos, IEEE Fellow, The University of Oklahoma, USA
• Prof. Aggelos Katsaggelos, IEEE Fellow, Northwestern University, USA
• Prof. Nikolaos Paragios, Ecole Centrale Paris, France
• Prof. Nikolaos G. Bourbakis, IEEE Fellow, Wright State University, USA
• Prof. Lei Xu, IEEE Fellow, Chinese University of Hong Kong, Hong Kong
• Prof. Sidney Burrus, IEEE Fellow, Rice University, USA
• Prof. Biswa N. Datta, IEEE Fellow, Northern Illinois University, USA
• Prof. George Vachtsevanos, Georgia Institute of Technology, Atlanta, Georgia, USA
• Prof. Jiri Hrebicek, Masaryk University, Brno, Czech Republic
• Prof. Sorinel Oprisan, College of Charleston, Charleston, South Carolina, USA
• Prof. Gen Qi Xu, Tianjin University, Tianjin, China
• Prof. Humberto Varum, University of Aveiro, Aveiro, Portugal

• Prof. Imre J. Rudas, Obuda University, Budapest, Hungary
• Prof. Brett Nener, The University of Western Australia, Australia
• Prof. Ronald Tetzlaff, Technical University Dresden, Germany
• Prof. Peter Szolgay, Pazmany Peter Catholic University, Hungary
• Prof. Xiang Bai, Huazhong University of Science and Technology, China
• Prof. Alexander Gegov, University of Portsmouth, UK
• Prof. Jan Awrejcewicz, Technical University of Lodz, Lodz, Poland
• Prof. Carla Pinto, Polytechnic of Porto, Porto, Portugal
• Prof. Hamid Reza Karimi, University of Agder, Grimstad, Norway
• Prof. Hung-Yuan Chung, National Central University, Taiwan
• Prof. Elbrous M. Jafarov, Istanbul Technical University, Istanbul, Turkey
• Prof. Bosukonda Murali Mohan, Indian Institute of Technology Kharagpur, Kharagpur, India
• Prof. Bharat Doshi, John Hopkins University, Mayrland, USA
• Prof. Gang Yao, University of Illinois at Urbana - Champaign, USA
• Prof. Lu Peng, Luisian State University, Baton Rouge, LA, USA
• Prof. Pavel Loskot, Swansea University, UK
• Prof. Abdullah Eroglu, Indiana University & Purdue University Fort Wayne (IPFW), USA
• Prof. Francesco Zirilli, Sapinenza Universitat di Roma, Rome, Italy
• Prof. Yoon-Ho Choi, Samsung Electronics Co. Ltd, South Korea
• Prof. Winai Jaikla, KMITL University, Bangkok, Thailand
• Prof. Ki Young Kim, Samsung Advanced Institute of Technology, Korea
• Prof. Ryszard S. Choras, University of Technology & Life Sciences, Bydgoszcz, Poland
• Prof. Hisashi Kobayashi, Princeton University, USA
• Prof. Leonid Kazovsky, Stanford University, USA
• Prof. Steven Collicott,Purdue University, West Lafayette, IN, USA
• Prof. Stephen Weinstein, Columbia University, USA
• Prof. Dharma P. Agrawal, University of Cincinnati, Cincinnati, OH, USA
• Prof. Jose M. F. Moura, Carnegie Mellon University, Pittsburgh, PA, USA
• Prof. Vijayakumar Bhagavatula (Fellow of OSA and SPIE), Carnegie Mellon University, Pittsburgh, PA, USA
• Prof. Liang-Gee Chen, National Taiwan University, Taiwan
• Prof. Ahmed H. Tewfik, University of Minnesota, USA
• Prof. Jenq-Neng, Hwang University of WA, Seattle, USA
• Prof. Amir Hussain, University of Stirling, Stirling, UK
• Prof. Gergely V. Zaruba, The University of Texas at Arlington, USA
• Prof. Mohammed Ghanbari, University of Essex, UK
• Prof. C.-C. Jay Kuo, University of Southern California, USA
• Prof. Amar Mukherjee, University of Central Florida, USA
• Prof. Athanassios Manikas, Imperial College, University of London, UK
• Prof. Dengsheng Zhang, Monash University, Australia
• Prof. Xingquan Zhu, University of Vermont, VT, USA
• Prof. Satnam Dlay, University of Newcastle upon Tyne, UK
• Prof. Nicholas P. Karampetakis, Aristotle University of Thessaloniki, Thessaloniki, Greece
• Prof. W. L. Woo, University of Newcastle upon Tyne, UK
• Prof. Vyacheslav Tuzlukov, Kyungpook National University, South Korea
• Prof. Stevan Berber, The University of Auckland, New Zeland
• Prof. Alexander Zemliak, Autonomous University of Puebla, Mexico
• Prof. Zoran Bojkovic, University of Belgrade, Serbia
• Prof. Etsuji Tomita, The University of Electrocommunications, Japan
• Prof. Lawrence Mazlack, University of Cincinnati, USA
• Prof. Tomas Zelinka, Czech technical University in Prague, Czech Republic
• Prof. Andrzej Chydzinski, Silesian University of Technology, Gliwice, Poland
• Prof. Winai Jaikla, King Mongkut's Institute of Technology Ladkrabang, Thailand

Communications: Microwave Theory and techniques, CAD design for Microwave Systems, Antennas and Radars, Lightwave technology, Submillimeter-Wave techniques, Microwave High-Power techniques, Microwave and millimeter-Wave Integrated Circuits, Microwave and millimeter-Wave Integrated Solid State Devices, Microwave Acoustics, Filter and Passive Components, Microwave and Antennas Measurements, Microwave Superconductivity, RFIC's, Wave-guides, Microwave propagation, Ferrites devices. Cavities. Microwave Circuits, Periodic Structures and Filters, Tubes, Masers, Amplifiers, HF-VHF-UHF Engineering, Antennas, Reflectors and Lens Antennas, Arrays, Scattering, Propagation, Diffraction, Electromagnetic Compatibility Problems, Applied Electromagnetics, Electromagnetic Field, Numerical Methods for Electromagnetics, Mathematical Methods and Computational techniues for Microwaves, Mathematical Methods and Computational techniues for Antennas and Radars, Radio Engineering applications in Astronomy, Navigation, Aerospace Systems, Low noise techniques, Optical Fiber Systems, Communication Electronics, Signal Processing for Wireless Communication., Communications Switching and Routing, Physical Layer, ISDN, Computer Networks, Architectural Aspects, ATM Networks, Protocols, Network Architecture, Network Reliability, Narrow band and Broad band Networks, Modern Routing Problems, Privacy and Security Problems, Queuing Theory and Communications, Traffic Problems, Wireless and Mobile Computing, Communication Systems Integration, Cryptology, Military Communications, Internet, Programming Techniques in Communications Networks, Simulation Techniques in Telecommunications, Software for Communications Development and Simulation, Social Implications of Modern Communications, Soft Computing and Communications, Smart Interfaces, Computer/Communications Integration, Others ...

Computers: Computer Languages, Software Engineering, Data Structures, File Structures and Design, Data Bases, Compilers, Knowledge and Data Technology, Pattern Analysis and Machine Intelligence, File Structures for on-line Systems, Operating Systems, Parallel and Distributed Systems, Information Systems, Complexity Theory, Computing Theory, Numerical and Semi-Numerical Algorithms, Object-Oriented Programming, Parallel Programming, Computerised Signal Processing, Computer Graphics, Computational Geometry, Machine Vision, Computer Elements, Computer Architecture, Computer Packaging, Fault Tolerance Computing, Mass Storage Systems, Microprocessors and microcomputers, Multiple valued Logic, Numerical Analysis, Finite Element, Genetic Algorithms, Game Theory, Operations Research, Optimization Techniques, Real Time Systems, Virtual Reality, Computer Algebra, Symbolic Computation, Simulation, Pattern Analysis, Machine Intelligence, Adaptive and Learning Systems, Classification, Identification, Chaos Fractals and Bifurcations, Analysis and design tools, Simulation, modelling, Emulation, Visualization, Digital Libraries, Hardware Engineering, Programming Techniques in Communications, Networks, Management and Economic Systems, Multimedia, Video technologies, Simulation Techniques Tools, Computers in Armed Forces, Software for Communications Development and Simulation, Social Implications of Modern Communications, Soft Computing and Communications, Smart Interfaces, Intelligent Systems, Supercomputers and Supercomputing, Internet and Internet Computing, Intelligent Agents, Mobile Computing, E-commerce, Privacy Problems, Hardware/Software Codesign,Cryptography, Computer/Communications Integration, Education, Others