ESPCO 2014: 2nd International Conference on
Electronics, Signal processing and Communications

Athens, Greece, November 28-30, 2014

About the Conference

* The Proceedings of the Conference will be published in CD-ROM and Hard-Copy (as book) with all the accepted and registered papers of the conferences and will be indexed in: ISI (Thomson Reuters), ELSEVIER, SCOPUS, Zentralblatt MATH, British Library, EBSCO, SWETS, EMBASE, CAS - American Chemical Society, EI Compendex, Engineering Village, DoPP, GEOBASE, Biobase, TIB|UB - German National Library of Science and Technology, American Mathematical Society (AMS), Inspec - The IET, Ulrich's International Periodicals Directory, Scholar Google.  Authors that prefer their publication in a Springer Verlag Volume can contact us: support@inase.org  

*
Extended Versions of all the Invited and Regular Papers will be published after the conference in 21 ISI Indexed Journals.

* Authors that prefer their extended version to appear in a Springer Verlag Volume can contact us after the conference at support@inase.org 

* Contact us by email: support@inase.org   Registration fees       Publication Ethics and Malpractice Statement     Deadlines
 (Previous Conference: ESPCO 2013, September of 2013 in Venice, Italy)     Check our recent conferences in Santorini, Varna, and Interlaken

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Paper Submission

Papers must be written in the correct format:  MS Word.doc  or LaTeX  or LaTeX2   and must be uploaded using the following form as .doc, or .pdf file. As in all the Previous Conferences, all the accepted and registered Papers will be indexed as peer-reviewed publications in ISI and SCOPUS and will be published in CD-ROM and Book (hard-copy). Extended Versions of all the Invited and Regular Papers will be published after the conference in 21 ISI Indexed Journals. Authors that prefer their extended version to appear in a Springer Verlag Volume can contact us after the conference at support@inase.org. Only full papers will be promoted to reviewers for thorough peer review. For the review process only active scholars with many recent publications in ISI and/or SCOPUS will be used and the list with their names will be published in the Proceedings: Hard-Copy and CD-ROM as in all our previous conferences. The deadline for paper submission expired. We do not accept papers any longer.

 

Organizing Committee

General Chairs (Editors)

  1. Prof. Bogdan Epureanu,
    University of Michigan
    Ann Arbor, MI 48109, USA
  2. Prof. Cho W. Solomon To,
    ASME Fellow, University of Nebraska,
    Lincoln, Nebraska, USA
  3. Prof. Hyung Hee Cho, ASME Fellow
    Yonsei University
    and The National Academy of Engineering of Korea,
    Korea
 

Program Chairs

  1. Prof. Zhongmin Jin,
    Xian Jiaotong University, China
    and University of Leeds, UK
  2. Prof. Constantin Udriste,
    University Politehnica of Bucharest,
    Bucharest
    Romania
  3. Prof. Sandra Sendra
    Instituto de Inv. para la Gestión Integrada de Zonas Costeras (IGIC)
    Universidad Politécnica de Valencia
    Spain

Tutorials Chair

  1. Prof. Pradip Majumdar
    Department of Mechanical Engineering
    Northern Illinois University
    Dekalb, Illinois, USA

Special Session Chair

  1. Prof. Essam Eldin Khalil,
    ASME Fellow,
    Cairo University, Cairo,
    Egypt

     

Workshops Chair

  1. Prof. Hyung Hee Cho, ASME Fellow,
    Yonsei University (and National
    Academy of Engineering of Korea),
    Korea

Local Organizing Chair

  1. Dr. Claudio Guarnaccia, University of Salerno, Italy

Publication Chair

  1. Prof. Marcin Kaminski,
    Department of Structural Mechanics,
    Al. Politechniki 6, 90-924 Lodz, Poland

Publicity Committee

  1. Prof. Kumar Tamma,
    University of Minnesota,
    Minneapolis, MN, USA
  2. Prof. Myriam Lazard
    Institut Superieur d' Ingenierie de la Conception
    Saint Die, France

International Liaisons

  1. Prof. Marina Shitikova,
    Voronezh State University of Architecture and
    Civil Engineering, Voronezh, Russia
  2. Prof. Olga Martin
    Applied Sciences Faculty
    Politehnica University of Bucharest
    Romania
  3. Prof. Vincenzo Niola
    Departement of Mechanical Engineering for Energetics
    University of Naples "Federico II"
    Naples, Italy
  4. Prof. Christopher G. Provatidis,
    National Technical University of Athens,
    Zografou, Athens, Greece

Steering Committee

  • Prof. Stefan Siegmund, Technische Universitaet Dresden, Germany
  • Prof. David A. Johnson, University of Waterloo, Canada
  • Prof. Wasfy B. Mikhael, University of Central Florida, Orlando, USA
  • Prof. Imre Rudas, Obuda University, Budapest, Hungary

Program Committee

  • Prof. Martin Bohner, Missouri University of Science and Technology, Rolla, Missouri, USA
  • Prof. Martin Schechter, University of California, Irvine, USA
  • Prof. Ivan G. Avramidi, New Mexico Tech, Socorro, New Mexico, USA
  • Prof. Michel Chipot, University of Zurich, Zurich, Switzerland
  • Prof. Xiaodong Yan, University of Connecticut, Connecticut USA
  • Prof. Ravi P. Agarwal, Texas A&M University - Kingsville, Kingsville, TX, USA
  • Prof. Yushun Wang, Nanjing Normal university, Nanjing, China
  • Prof. Patricia J. Y. Wong, Nanyang Technological University, Singapore
  • Prof. Andrei Korobeinikov, Centre de Recerca Matematica, Barcelona, Spain
  • Prof. Jim Zhu, Western Michigan University, Kalamazoo, MI, USA
  • Prof. Ferhan M. Atici, Department of Mathematics, Western Kentucky University, USA
  • Prof. Gerd Teschke, Institute for Computational Mathematics in Science and Technology, Neubrandenburg, Berlin-Dahlem, Germany
  • Prof. Meirong Zhang, Tsinghua University, Beijing, China
  • Prof. Lucio Boccardo, Universita degli Studi di Roma "La Sapienza", Roma, Italy
  • Prof. Shanhe Wu, Longyan University, Longyan, Fujian, China
  • Prof. Natig M. Atakishiyev, National Autonomous University of Mexico, Mexico
  • Prof. Jianming Zhan, Hubei University for Nationalities, Enshi, Hubei Province, China
  • Prof. Narcisa C. Apreutesei, Technical University of Iasi, Iasi, Romania
  • Prof. Chun-Gang Zhu, Dalian University of Technology, Dalian, China
  • Prof. Abdelghani Bellouquid, University Cadi Ayyad, Morocco
  • Prof. Jinde Cao, Southeast University/ King Abdulaziz University, China
  • Prof. Josef Diblik, Brno University of Technology, Brno, Czech Republic
  • Prof. Jianqing Chen, Fujian Normal University, Fuzhou, Fujian, China
  • Prof. Naseer Shahzad, King Abdulaziz University, Jeddah, Saudi Arabia
  • Prof. Sining Zheng, Dalian University of Technology, Dalian, China
  • Prof. Leszek Gasinski, Uniwersytet Jagielloński, Krakowie, Poland
  • Prof. Satit Saejung, Khon Kaen University, Muang District, Khon Kaen, Thailand
  • Prof. Juan J. Trujillo, Universidad de La Laguna, La Laguna, Tenerife, Spain
  • Prof. Tiecheng Xia, Department of Mathematics, Shanghai University, China
  • Prof. Stevo Stevic, Mathematical Institute Serbian Academy of Sciences and Arts, Beogrand, Serbia
  • Prof. Lucas Jodar, Universitat Politecnica de Valencia, Valencia, Spain
  • Prof. Noemi Wolanski, Universidad de Buenos Aires, Buenos Aires, Argentina
  • Prof. Zhenya Yan, Chinese Academy of Sciences, Beijing, China
  • Prof. Juan Carlos Cortes Lopez, Universidad Politecnica de Valencia, Spain
  • Prof. Wei-Shih Du, National Kaohsiung Normal University, Kaohsiung City, Taiwan
  • Prof. Kailash C. Patidar, University of the Western Cape, Cape Town, South Africa
  • Prof. Hossein Jafari, University of Mazandaran, Babolsar, Iran
  • Prof. Abdel-Maksoud A Soliman, Suez Canal University, Egypt
  • Prof. Janusz Brzdek, Pedagogical University of Cracow, Cracow, Poland
  • Dr. Fasma Diele, Italian National Research Council (C.N.R.), Bari, Italy.

 

Topics of Interest

Microelectronics:

  • Device characterization and modeling
  • Device physics and novel structures
  • Materials and characterization techniques
  • Reliability and failure analysis
  • Radiation effects
  • Packaging, surface mount technology
  • Optoelectronics
  • MEMS and MOEMS devices
  • Smart power devices and sensors
  • Custom and semi-custom circuits
  • Interconnects
  • Embedded system design
  • Systems on Chip (SoCs)
  • Reconfigurable chip design
  • Design for testability
  • Low-voltage, low-power VLSI design
  • ANN applications
  • Circuits for wireless communications
  • Modelling and simulation (process, device, circuit, logic, timing, functional)
  • Trends in sub-micron technologies
  • Special microelectronic devices (magnetic memory, novel memory, imaging)
  • Signal processing and multiplexing
  • DRAM, SRAM, flash high density, NVM
  • Logic/microprocessors, embedded logic
  • SiGe, GaN, and SiC devices
  • SOI
  • RF mixed analog/digital
  • Quantum computing
  • Microactuators, sensors and sensor networks
  • Biomimetic devices
  • Terahertz technology
  • System level verification


  • Nanoelectronics:
  • Nanomaterial
  • Nanofabriction
  • Nanomeasurement
  • Nanodevice
  • Nanocircuit
  • Nanocharacterization
  • Advanced silicon devices and device physics
  • Nanotechnology for IC manufacturing
  • RF and mixed signal ICs
  • Noise behavior of MOS structures
  • Non-volatile memory technologies
  • Computational nanoelectronics
  • Particle simulation methods
  • Parameter extraction techniques
  • Interconnect modeling and algorithms
  • Modeling fabrication processes and equipment
  • Ballistic and quantum mechanical effects
  • Characterization and processing of new materials
  • Reliability of nanodevices and ESD design
  • Novel devies and post-CMOS silicon device structure
  • Key process technologies to integrate sub-100 nm Si ULSIs
  • Advanced physics in nanoelectronics analysis and synthesis
  • Physics and chemistry of surface and interface phenomena
  • Sub-100 nm silicon CMOS devices and their integration technologies
  • Process control, failure analysis, yield enhancements and modeling
  • Analytical methods and simulation algorithms for nanoelectronics
  • Advanced silicon circuits and systems
  • Advanced digital, analog, mixed-signal, and memory
  • Low power technologies and power aware systems
  • Integration of circuit and device simulation
  • Analog and digital circuits composed of nanodevices
  • System-level integration and packaging technologies
  • Chemical phenomena in the design of nanocircuits
  • Neural network, fuzzy logic, and multi-valued logic
  • Physical and circuit models of nanodevices and interconnects
  • Benchmarking, calibration, and verification of simulators
  • Integrated nanolelectronics and multifunction integrated circuits
  • Design, modeling, and simulation of nanoelectronic integrated circuits
  • Design and CAD technologies for the advanced packaging and system integration
  • Modeling and simulation of thermal, mechanical and electrical performance of packaging and system integration


  • Quantum Electronics:
  • Spintronics
  • Quantum computing
  • Single electron devices
  • Nanotubes and nanostructures
  • Quantum phenomena in nanoscale
  • Dynamics of nanostructures
  • Quantum transport and quantum devices
  • Quantum wire, quantum well, and quantum dot
  • Wireless cellular automata
  • Hybrid micro-nanoelectronic logic
  • Heterostructures and superlattices
  • Compound semiconductor materials and devices
  • Self-assembly, nano and molecular scale devices
  • Spin and carrier control in quantum nanostructures
  • Ab-initio calculations of the electronic properties of nanostructures


  • Biomolecular Electronics:
  • Molecular switches
  • Molecular electronics
  • Molecular manufacturing
  • Molecular electronic devices
  • Nanocomputing-nanocomputers
  • Functioning molecular wires
  • Inorganic nanowires and nanocrystals
  • Molecular electronic memory technology
  • Molecular computing-molecular computers
  • Circuit paradigm in molecular electronics
  • Organic semiconductor devices and materials
  • Electrical properties of organic thin film and materials
  • DNA computing
  • Biophysics
  • Biocomputing and biocomputers
  • User interfaces and visualization
  • Bioelectronics and bioinformatics
  • Biomedical and microfluidic applications
  • Biotechnologies in the design of nanocircuits
  • Biomedical engineering and biomedical electronics
  • Carrier transport in molecular and biological systems
  • Algorithms and biochips for DNA, healthcare and proteins
  • Micro-nano electromechanical devices for bio- and chemical applications
  • High performance computing, numerical methods and algorithms, including optimization
  • Computational methods and integrated systems for biochemical and medical applications



  • Optoelectronics:
  • Optical Fibers
  • Optical Cables
  • Optical Fiber Devices
  • Fabrication, installations
  • Fiber Bragg gratings
  • Lightwave circuits
  • Optical Fiber amplifiers and lasers
  • Optical Polymer fibers
  • Photonic crystal fibers and related topics
  • Optical Active Devices and Modules
  • Semiconductor lasers, detectors and their arrays
  • Light emitting devices
  • Semiconductor laser amplifiers
  • Waveguide laser amplifiers
  • Optoelectronic/photonic integrated circuits
  • Optical logics, memories and other functional devices
  • Related materials, device fabrication and device physics
  • Packaging and modules and related topics
  • Optical Passive Devices and Modules
  • Optical waveguide integrated devices/circuits; Planar
  • Optical isolators and circulators
  • Optical modulators and switches
  • Optical fiber-waveguide coupling, packaging and modules
  • Planar glass and polymer materials and device fabrication
  • Photonic crystals
  • Optical MEMS, Micro-optics and related topics
  • Optical Transmission Systems and Technologies
  • High speed optical transmissions
  • Wavelength division multiplexing
  • Ultra-long haul transmissions
  • Trans-oceanic systems
  • FTTx systems
  • Optical interconnection
  • Optical signal processing
  • Optical analog systems and related topics
  • Optoelectronic Networks and Applications
  • Optical networking, architectures, design and planning



    Signal Processing
  • Filter design and structures
  • Fast algorithms
  • Adaptive filters
  • Nonlinear Signals and Systems
  • Multirate filtering and filter banks
  • Signal reconstruction
  • Time-frequency analysis
  • Spectral estimation
  • Higher order spectrum analysis
  • Parameter estimation
  • Detection
  • Array signal processing
  • Statistical signal analysis
  • Signal and system modeling
  • Cyclostationary signal analysis
  • Speech production and perception
  • Speech analysis
  • Speech synthesis
  • Speech coding
  • Speech recognition
  • Speech enhancement and noise reduction
  • Active noise control
  • Active noise reduction
  • Echo cancellation
  • Psychoacoustics
  • Broadband audio coding
  • Signal processing for music
  • Binaural systems
  • Room acoustics
  • Digital transforms
  • HDTV
  • Multidimensional systems
  • Machine vision
  • Image coding
  • Image motion / sequence / video
  • Computed imaging
  • Geophysical and seismic processing
  • Image analysis and segmentation
  • Image filtering, restoration and enhancement
  • Image representation and modeling
  • Pattern recognition
  • Multisensor Data Fusion
  • Architectures and VLSI hardware
  • Programmable signal processors
  • Algorithms and applications mappings
  • Design methology and CAD tools
  • Languages and real time software
  • Real time system estimation
  • Optimization problems in signal processing
  • Radar
  • Sonar
  • Biomedical processing
  • Geophysical signal processing
  • Underwater signal processing
  • Remote sensing
  • Robotics
  • Astronomy
  • Satellite signals processing
  • Measure and Instrumentation


  • Communications
  • Microwave Theory and techniques
  • Applications of Microwaves in Biomedicine
  • Computational Methods for Microwaves Engineering
  • CAD design for Microwave Systems
  • Microwaves Circuits
  • Finite Differences, Finite Volumes, Finite Elements for Microwaves
  • Boundary Elements Method (BEM) applied in Microwaves problems
  • Antennas and Radars
  • Finite Differences, Finite Volumes, Finite Elements for Antennas
  • Boundary Elements Method (BEM) applied in Antennas problems
  • Lightwave technology
  • Submillimeter-Wave techniques
  • Microwave High-Power techniques
  • Microwave and millimeter-Wave Integrated Circuits
  • Microwave and millimeter-Wave Integrated Solid State Devices
  • Microwave Acoustics
  • Filter and Passive Components
  • Microwave and Antennas Measurements
  • Microwave Superconductivity
  • RFIC's
  • Wave-guides
  • Microwave propagation
  • Ferrites devices. Cavities. Microwave Circuits
  • Periodic Structures and Filters
  • Tubes
  • Masers
  • Amplifiers
  • HF-VHF-UHF Engineering
  • Antennas
  • Reflectors and Lens Antennas
  • Arrays
  • Scattering
  • Propagation
  • Diffraction
  • Electromagnetic Compatibility Problems
  • Applied Electromagnetics
  • Electromagnetic Field
  • Numerical Methods for Electromagnetics
  • Mathematical Methods and Computational techniques for Microwaves
  • Mathematical Methods and Computational techniques for Antennas and Radars
  • Radio Engineering applications in Astronomy
  • Navigation
  • Aerospace Systems
  • Low noise techniques
  • Optical Fiber Systems
  • Communication Electronics
  • Signal Processing for Wireless Communication.
  • Communications Switching and Routing
  • Physical Layer
  • ISDN
  • Computer Networks
  • Architectural Aspects
  • ATM Networks
  • Protocols
  • Network Architecture
  • Network Reliability
  • Narrow band and Broad band Networks
  • Modern Routing Problems
  • Privacy and Security Problems
  • Queuing Theory and Communications
  • Traffic Problems
  • Wireless and Mobile Computing
  • Communication Systems Integration
  • Cryptology
  • Military Communications
  • Internet
  • Programming Techniques in Communications Networks
  • Simulation Techniques in Telecommunications
  • Software for Communications Development and Simulation
  • Social Implications of Modern Communications
  • Soft Computing and Communications
  • Smart Interfaces
  • Computer/Communications Integration
  • Education.
     

     
  • Location and Venue

    Conference Guide

    About:     Athens     Map of  Athens     Photos from Athens     Hotel (Conference Venue)     How to get to Athens     Athens Travel Guide

    Conference Publications

    Accepted Papers are going to be published in

    (a) Book, Hard-Copy Proceedings (will be indexed in: ISI, SCOPUS, EI Compendex, AMS, ACS, CiteSeerX, Zentralblatt, British Library, EBSCO, SWETS, EMBASE, CAS, Scholar Google etc)


    (b) CD-ROM Proceedings (will be indexed in: ISI, SCOPUS, EI Compendex, AMS, ACS, CiteSeerX, Zentralblatt, British Library, EBSCO, SWETS, EMBASE, CAS, Scholar Google etc)


    (c) Extended Versions of all the Invited and Regular Papers will be published after the conference in 21 ISI Indexed Journals.
    * Authors that prefer their extended version to appear in a Springer Verlag Volume can contact us at support@inase.org


    (d) E-Library with free access for all (no username, no password).